Semikron has introduced the first 100% solder-free IGBT module
Industry is on the safety systems were discussed. Expected to be officially implemented in early 2008 in Europe. XC2300 series has covered a number of scalability and compatibility of automotive electronic safety systems, and software and hardware can be reused. The product line features high-performance central processing unit (CPU), in 80MHzH ~ per second can handle up to 80 million instructions. XC2300 Series Flexible USICf Universal Serial Interface Channel 1 can be configured for UART (Universal Asynchronous Receiver Transmitter), LIN (local interconnect network), the buffer SPIf Serial Peripheral Interface), I2C (interconnect IC) bus or I2SfIC between audio) interface. In addition, MuhiCANfCAN2.0B current version of a three CAN nodes can provide the flexibility to allocate up to 64 message objects. And gateway functionality. Because of the low-power XC2300f kept below the maximum performance 80MHz 60mA1 only a very small solder-free pressure contact system voltage regulator and internal cascade bus makes the current uniform. IGBT and diode chips each have their own connection to the main terminal. This will bring a small module resistance Rcc, m. ≤ 0-3m12, usually about the resistance welding module 1.1m12. To achieve high capacity and fast cycle-free solder installed, the device is connected to the drive plate without welding, and with a spring. The chip without soldering but after sintering, can achieve high power cycle. Sintered contacts is a thin silver layer,
tory burch outlet, the layer of silver solder better than the thermal resistance. As the melting point of silver, and no joint fatigue. Thus extending the life of small products. Because there is no substrate,
love bracelet cartier, PCB connection to the radiator can be moved and would not impose any restrictions on the temperature cycle reliability brought SKiM ~ stand the test of rigorous automotive standards. Has a high resistance to shock and vibration stress. Sl (iM0 module packaging and connection technology takes advantage of silicon's ability to produce a good cost-effective solution Infineon meet future safety standards and scalable XC2300 Series micro-controller device. Supraspinatus this. May reduce system cost. XC2300 between will be equipped with 128kB ~ 1.6MB flash memory, both for the safety of air bags and highly complex systems, such as power steering, chassis control system and sensor assembly. XC2300 has an extensive product portfolio, plans to launch more than 50 models of products that enable secure application design engineers in the selection MCUI ~, can be for memory, peripherals, frequency, temperature and packaging methods to select the best combination of functionality and performance to meet application requirements both in terms not During the design cycle or after the end of the printed circuit board design are not required to make any changes once the software for Infineon's XC2300 microcontrollers were compiled, can be easily used in different models of vehicle manufacturers within the platform of security applications Product development, identification, verification and testing of integrated cost savings of up to 30% for safety-critical applications, such as airbags, steering and braking systems, all system components need to have the highest levels of reliability, so all XC2300 Series components have been specially designed. to meet the stringent safety requirements, which also includes a set of security-related functions, such as J has ECCf all memory error correction code), memory protection, functional redundancy, and include CRCf cyclic redundancy I check), including multiple control mechanisms. These essential features help to support and enable all XC2300 products meet the requirements of the system IEC61508fSIL31. Infineon introduced the XC2300 products in this series in the first two products XC2365 and XC2387. A total of 16 software-compatible and pin-compatible products. The difference between products in the size of its flash memory (384KB, 448KB and 576KB1, ADC channels f16 or 241,
ghd planchas, the frequency f66MHz or 80MHz), Si-f a temperature range 40 ℃ ~ +85 ℃ or a 40oC- +125 oC), and lead a green f low-profile quad flat package fLow-QuadFlatPack, LQFP) package options fLQFP a 100 a 144). In addition, Infineon in 2008, will introduce more models, the size of their memory capacity expanded from 128KB to 1.6MB,
p90x workout schedule, while the new FlexRay interfaces as well as 64 and 176 ~ 3l-pin LQFP package and so on. XC2300 series can be supported by a small set of development. Including evaluation boards, debuggers, compilers and related documents.
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