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Vista Home (www.vista123.com): ten actions of: from sand to chip - see The right way to Make the processor

can be mentioned that the central processing unit (CPU) will be the modern Social speedy operation with the power source, in any electronic system could be discovered around the microchip with the figure, but it was also dismissed, the processor,Office 2010 Home And Student Key, this factor is no technical content, but a pile of sand within the aggregate only. Isn't it? Intel right now announced a substantial quantity of display information, showing in detail the chip from the sand to the entire process, uncomplicated or not see at a glance.
simply,Windows 7 Starter Sale, the processor may be roughly divided in to the sand inside the manufacturing method of raw materials (quartz), silicon ingots, wafers, lithography (offset printing), etching, ion implantation, metal deposition, metal layer, interconnect, wafer testing and cutting, the core package, class testing, packaging market, and many other steps, and within every move of the procedure and includes much more detail.


beneath to combine graphic, step-by-step look at:



sand: Silicon will be the second plentiful aspect in the crust , and right after the sand oxygen (specially quartz) contain up to 25% of the silicon to silicon dioxide (SiO2) in the kind, which is the basis for your semiconductor manufacturing business.


silicon melting: 12 inches / 300 mm wafer stage, the very same below. Obtained by multi-step purification for silicon semiconductor production top quality, generic electronic grade silicon (EGS), an common of each million silicon atoms inside the most one impurity atom. This diagram exhibits how the purification via the melting of silicon crystals are substantial, the resulting ingot is (Ingot).


monocrystalline silicon ingots: the overall fundamental cylindrical, weighing about one hundred kg of silicon purity of 99.9999%.

the very first phase of the photo





silicon ingot cutting: a single horizontal minimize into circular silicon , that's, we regularly say the wafer (Wafer). By the way, this will be the subsequent spherical wafer know why, suitable?


Wafer: Soon after cutting out the wafers right after polishing gets nearly perfect, even once the mirror surface. In fact, Intel itself does not produce the wafers, but from a 3rd party semiconductor businesses to purchase items there, and then use their own production line for additional processing, for example the now mainstream 45nm HKMG (high-K steel gate.) It can be worth mentioning that,Office Home And Business Product Key, Intel organization was founded together with the wafer dimension is only two inches / fifty mm.

the next phase of the photo





photoresist (Photograph Resist): proven in blue is poured within the wafer in the course of rotation to the photoresist liquid, comparable for the kind of traditional movie production. Store photoresist wafer rotation permits particularly thin, particularly flat.


lithography: photoresist layer followed by mask (Mask) was uncovered to ultraviolet (UV) below,Buy Microsoft Office 2010, turn into soluble, comparable to the chemical reactions that happen during Press the mechanical movie digital camera modifications the instant the shutter. Pre-designed mask about the printed circuit pattern, by means of which shines ultraviolet photoresist layer, every layer will type a microprocessor circuit design. In general, the circuit pattern on the wafer from the mask pattern is one-fourth.


lithography: the resulting nano-sized transistors in to the 50-200 level. A wafer might be reduce from many processors, but the see from right here down to 1, and indicate how you can make transistors as well as other elements. The equivalent of switching transistor to control the existing path. Now the transistor is so modest that a needle will probably be capable to place down about 30 million.
3rd phase of the picture





photoresist dissolution: the exposure to ultraviolet lithography lithography under glue is dissolved away, leaving the patterns and cleared about the same mask.


etching: the use of chemical substance is dissolved from exposed parts with the wafer, whilst the remaining photoresist safeguards the part should not be etched.


get rid of photoresist: etching is completed, resist the mission declared finished, all crystal clear immediately after the designed circuit pattern could be observed.

the fourth stage a picture





resist: resist doused again (blue part), then lithography, and wash exposed components with the remaining photoresist is employed to protect that part of ion implantation isn't materials.


ion implantation (Ion Implantation): inside a vacuum program, by means of the accelerated use to ion irradiation doping atoms (injection) of sound materials, which was injected inside the Regional formation of the unique injection layer, and change the conductivity of silicon location. Soon after the electrical field acceleration, the velocity of ion implantation may be additional than 30 million km per hour.


photoresist removal: ion implantation is completed, the photoresist was eliminated, and to the region (green) has also been doped into distinctive atoms. Note that this time the green and different from before.

fifth stage a picture





transistors in location: At this point, the transistor may be basically accomplished. In the insulation material (magenta) to the 3 holes etched, and filled up with copper to interconnect with other transistors.


Plating: plating a layer of copper sulfate to the wafer, the copper ion deposition towards the transistor. Copper ions through the cathode (anode) to negative (cathode).


copper layer: After plating, copper ions deposited to the wafer surface, forming a skinny copper layer.

sixth stage a photo



polishing: polishing off the excessive copper, which is the polished wafer surface.


metal layers: the transistor stage, the combination of the 6 transistors, about 500 nm. Complicated shaped among the diverse transistor interconnect metal layer, depending on the distinct layout of the distinct needs with the corresponding processor functionality. Chip look irregular easy surface, but actually might contain 20 multi-storey complicated circuits can be witnessed immediately after amplification circuit network is really complex, multi-layer shaped like a futuristic highway method.

seventh stage a picture





wafer testing: the kernel degree, about ten mm / 0.5 inch . The image is really a partial wafers, being the very first functional check, utilizing the reference circuit pattern, and each chip were in contrast.


wafer slices (Slicing): wafer-level, 300 mm / twelve inches. The wafers into items, each piece is really a processor core (Die).


discarded faulty kernel: wafer level. The check defects discovered during a kernel abandoned, leaving intact for the following step.

eighth stage of photograph





single kernel: kernel level. Wafer was lower from just one core, exactly where the demonstrate is the core of Core i7.


Package: package-level, twenty mm / 1 inch. Substrate (substrate), the kernel, the warmth sink stacked collectively to kind the way we see the processor. Substrate (green) is equivalent to a base, and for the processor core gives electrical and mechanical interface with all the Pc easily interact with other parts of the system. Heat sink (silver) is responsible for cooling the core.


Processor: At this time the processor has to be total (this is a Core i7). The world's most clear space manufactured goods are actually probably the most complex will be the result of many hundreds of actions might be achieved, right here only demonstrate some of the crucial steps.

the ninth stage of a picture





stage test: the final test, can identify every one The key qualities with the processor, for instance maximum frequency, energy usage,Windows 7 Enterprise X64, heat, and so on., and figure out the level of the processor, for instance, made the most high-end Core i7-975 Excessive, or the low-end Core i7-920.


Packing: According to the amount of the check results will be the identical level of processors shipped with each other.


retail packaging: manufacturing, testing accomplished batch delivered towards the OEM processor or manufacturer, or about the packaging box to enter the retail market. Core i7 is the case right here.

the tenth stage of a photograph

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