Other links at Electronics and Electrical > Components > Semiconductors > Materials and Supplies |
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III/V-Reclaim
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to 150mm wafers, removing all layers and structures. Offers single and double side polishing. Based in Germany.
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GPM, Inc.
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Specializing in the fabrication and repair of silicon wafer dicing chucks for the semiconductor industry.
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Rodel Inc.
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Offers a fully-integrated solutions for chemical mechanical planarization (CMP) and surface preparation needs for semiconductor devices, silicon and other substrate wafers, computer memory disks, and precision optics.
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